1. Ukuphazamiseka Kokuziphatha: 50Ω
2. Ibanga Lemvamisa: 0-4GHz
3. Xhumana ne-Inner Conductor ye-Resistance: ≤10 mΩ Out conductor: ≤4mΩ
4. I-Insulation Resistance≥5000MΩ
5. I-Dielectric Withstand≤1.306.
6. Ukuqina imijikelezo engu-500
1. Ingcaphuno yombuzo-Professional.
2. Qinisekisa intengo, isikhathi sokuhola, umsebenzi wobuciko, isikhathi sokukhokha njll.
3. Ukuthengisa kwe-Telsto kuthumela i-invoyisi ye-Proforma enophawu lwenkululeko.
4. Ikhasimende lenza inkokhelo yediphozithi futhi lisithumelele irisidi yaseBhange.
5. Isiteji Sokuqala Sokukhiqiza-Yazisa amaklayenti ukuthi siyitholile inkokhelo, Futhi sizokwenza amasampula ngokwesicelo sakho, sikuthumelele izithombe noma Amasampuli ukuze uthole imvume yakho. Ngemva kokugunyazwa, sazisa ukuthi sizohlela ukukhiqiza futhi sazise isikhathi esilinganiselwe.
6. I-Middle Production-thumela izithombe ukuze ubonise ulayini wokukhiqiza ongabona imikhiqizo yakho. Qinisekisa isikhathi sokulethwa esilinganiselwe futhi.
7. Imikhiqizo Yokuqeda Ukukhiqiza-Inqwaba izithombe namasampula azokuthumela ukuze uthole imvume. Ungakwazi futhi ukuhlela Ukuhlola komuntu wesithathu.
8. Amaklayenti akhokha ibhalansi kanye ne-Freedom Ship izimpahla. Futhi ingamukela isikhathi sokukhokha Ibhalansi ngokumelene ne-B/L Copy Noma Isikhathi sokukhokha se-L/C. Yazisa inombolo yokulandelela futhi uhlole isimo samakhasimende.
9. I-oda lingasho ukuthi “qeda” lapho wamukela izimpahla futhi wanelisa ngazo.
10. Impendulo Yenkululeko mayelana Nekhwalithi, Isevisi, Impendulo Yemakethe & Nesiphakamiso. Futhi singenza kangcono.
Imodeli:TEL-DINF.158-RFC
Incazelo
I-DIN Isixhumi sesifazane sekhebuli eguquguqukayo engu-1-5/8″
Material kanye Plating | |
Oxhumana naye maphakathi | I-Brass / Silver Plating |
I-insulator | I-PTFE |
Umzimba & Umqhubi Wangaphandle | Ithusi / ingxubevange ehlanganiswe ne-tri-alloy |
I-Gasket | I-Silicon Rubber |
Izici zikagesi | |
Impedance yezici | 50 ohm |
I-Frequency Range | I-DC~3 GHz |
I-Insulation Resistance | ≥10000MΩ |
Amandla e-Dielectric | Amandla angu-4000 V |
Ukumelana nokuxhumana nendawo | ≤0.4mΩ |
Ukumelana nokuxhumana kwangaphandle | ≤1.5 mΩ |
Ukulahlekelwa Kokufaka | ≤0.12dB@3GHz |
I-VSWR | ≤1.15@-3.0GHz |
Izinga lokushisa | -40 ~ 85℃ |
I-PIM dBc(2×20W) | ≤-160 dBc(2×20W) |
Ingangeni manzi | IP67 |
Imiyalo yokufakwa kwe-N noma 7/16 noma 4310 1 / 2″ intambo eguquguqukayo kakhulu
Isakhiwo sesixhumi: ( Fig1 )
A. nati langaphambili
B. back nut
C. gasket
Ubukhulu bokuhlubula bunjengoba kukhonjiswe kumdwebo (Fig2), ukunakwa kufanele kukhokhwe ngenkathi kuhlubula:
1. Indawo yokugcina ye-conductor yangaphakathi kufanele i-chamfered.
2. Khipha ukungcola okufana nesikali sethusi bese ubhalisa ekugcineni kwekhebula.
Ukuhlanganisa ingxenye yokuvala: Khipha ingxenye yokuvala eduze komqhubi wangaphandle wekhebula njengoba kukhonjisiwe umdwebo (Fig3).
Ukuhlanganisa nati emuva (Fig3).
Hlanganisa inati langaphambili nangemuva ngokukruqula njengoba kukhonjiswe kumdwebo (Amakhiwane( 5)
1. Ngaphambi kokujija, gcoba ungqimba lwamafutha okugcoba kwi-o-ring.
2. Gcina inadi elingemuva nekhebula kunganyakazi, Khipha umzimba wegobolondo elikhulu emzimbeni wegobolondo elingemuva. Skrolela phansi igobolondo elikhulu lomzimba wegobolondo langemuva usebenzisa isikrufu senkawu. Ukuhlanganisa kuphelile.